Science and Technology of Energetic Materials

Vol.75, No.3 (2014)


Comparison between dismantlability and thermal behavior of adhesives containing various inorganic/organic salts
Katsumi Katoh, Nobuyuki Saeki, Eiko Higashi, Katsuyuki Nakano, and andMasahiko Sugimoto


The authors previously showed that epoxy adhesives containing various salts such as ammonium perchlorate were dismantled at lower temperature than filler-free epoxy adhesives. These adhesives are expected to be used as dismantlable adhesives. In this fundamental study on dismantlable adhesives, we conducted differential scanning calorimetry (DSC) for 13 types of filler-containing adhesives, and compared the observed thermal behaviors and dismantlabilities. In the DSC results for filler/adhesive mixtures with comparatively high dismantlabilities, which completely lose adhesion strength at lower than 280℃ (dismantlement temperature ≤ 280℃ ), the exothermic peak temperatures (Texo) and/or the endothermic peak temperatures (Tendo) tended to shift to lower values compared with the temperatures for the unmixed adhesive and individual fillers. In contrast, no such shifts in Texo and Tendo were observed in mixtures with low dismantlabilities (dismantlement temperature >280℃ ). Thus, the thermal behaviors differ depending on the dismantlability, so we consider that the dismantlabilities of adhesives as a result of chemical reactions can be qualitatively discriminated using DSC.

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dismantlable adhesive, epoxy adhesive, construction adhesive, ammonium perchlorate, DSC.

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